環境資源報告成果查詢系統

電木複合材料技術及設備之開發

中文摘要 由於環保意識的抬頭，促使資源回收再利用等相關議題，受到國際社會大眾的重視。全球印刷電路板的主要應用而言，約有34.8％應用在電腦及其週邊產品，26.1％應用在汽車和消費性產品上。至於國內部份，其中有72％應用在電腦和週邊產品，19％應用在通訊產品。3C產品固然帶給人們優異的生活品質，然而其汰換率甚高，若不將此資源回收再利用，將造成重大的環境污染。本研究即用資源回收的聚烯烴（polyolefin）類塑膠與回收印刷電路基板（PCB）粉末（俗稱電木粉）形成複合材料。 本計畫利用乾式研磨設備，研磨粒徑達400mesh（＜30μm），已達目標值，同時建立偶合相容化技術及押出造粒技術，並建立電木複材物性及完成押出及射出成品。
中文關鍵字 印刷電路板、複合材料、偶合,

基本資訊

專案計畫編號 EPA-93-U1U4-04-010 經費年度 093 計畫經費 4100 千元
專案開始日期 2004/07/01 專案結束日期 2005/03/31 專案主持人 官振豐
主辦單位 永續發展室(停用) 承辦人 執行單位

成果下載

類型 檔名 檔案大小 說明
期末報告 0000082093.pdf 25MB [期末報告]公開完整版

Development of technology and equipments on phenolic composite

英文摘要 With the wake up of the environment consciousness, the resource recycling issue is taken seriously by the international community. According to the research on the world PCB application, about 34.8% was applied to PC and its peripheral and 26.1% was applied to cars and consumer goods. As regards domestics, 72% was applied to PC and its peripheral and 19% was applied to communication products. Though 3C products have brought the perfect quality of life, they are easily to be weeded out. If we do not recycle this kind of resources, our environment will be polluted critically. This research is compounding the recycling polyolefin and PCB powders into a composite. Up to now, the particles have been ground into 400 mesh (<30μm) with the dry ground equipment, which has reached the target in this plan; meanwhile, we have developed the compounding and profiled extrusion techniques. The set-up of the material property and the produce of the press products will be carried out in the future.
英文關鍵字 PCB，Composites，Coupling