EPA-104-X08

104

950 千元

2015/01/01

2015/11/30

郭俞麟

回收基管會

李日琳

國立台灣科技大學

廢棄物管理

廢棄電路板、錫鉛分離

Separation technology of Tin-Lead metals, Waste PCB Solders

柯季良

02-27333141#7925

D10303012@mail.ntust.edu.tw

本技術名稱為:『廢印刷電路板焊料之錫鉛金屬分離技術開發（２年之第１年）』。過去回收業者在處理廢印刷電路板方式為使用強酸型藥劑（如:濃硝酸）對廢印刷電路板進行酸洗，並將電路板上之金屬剝除於藥劑中，並對有價金屬進行回收；然而，對於廢印刷電路板上之其他不具經濟價值之重金屬則是任意排放於河川中或掩埋於土壤中，將對環境造成嚴重汙染，也可能對人體造成慢性中毒的傷害。本團隊透過文獻資料蒐集並以實驗測試，期望能建立有效分離錫鉛之相關技術，進而分離出對環境有害之鉛金屬以及具有經濟價值之錫金屬。本研究計畫經文獻資料蒐集與參考設計出錫鉛分離程序，並由純錫粉末先行試驗再對相關參數進行調整，其中錫鉛粉末溶解效率達到９８．５２ %，沉降效率達到９９．１４ %，錫金屬回溶效率達到７８．０９%，且分離率為１００%，經由錫鉛焊料粉末分離程序試驗後，有效將錫鉛金屬進行分離，且能將錫金屬進行回收。本團隊將以第一年實驗成果為基礎，並於第二年之廢棄電路板回收部分建立分離與回收程序，期望能有效解決台灣回收業對錫鉛金屬分離的技術瓶頸，並減少鉛金屬廢棄物對於環境的危害與進行有價錫金屬的再回收利用。

廢棄電路板、錫鉛分離

EPA-104-X08.pdf

4MB

2016/2/1 上午 12:00:00

This project is focused on the recovery separation of tin-lead solder from waste printed circuit boards (PCB). Recently, the price of tin metal has risen and the quantity of waste electrical appliances was significantly increased. In the past years, the chip units on PCB were manufactured by soldering tin-lead alloys in the solder system. However, the way to separate them was not efficient. In the published reports, distillation, ion replacement method, and symbiotic silicon fluoride acid separation were used to separate tin-lead acquisition. However, the above techniques required special equipments, and were not easy to achieve the scale-up process from the model of laboratory evaluation. Through this project, the simple and fast method to separate the lead and tin metals from solder system was conducted in three steps: dissolution process, precipitation process, and re- dissolution process. The result showed that 98.52% of lead-tin powder has been dissolved into the solution, 99.14% of tin-lead solution precipitated into tin-lead solid compound, and 78.09% of tin without any lead residues has been re-dissolved from tin-lead solid compound. With these steps, lead and tin in solder can be separated completely and efficiently, and the tin metal could also refine and reuse again. In the following years, the project will focus on the separation of tin-lead solder from waste printed circuit board (PCB) and wish to create a high value and environmental friendly procedure to solve the related issue in recycling industry.

Separation technology of Tin-Lead metals, Waste PCB Solders